Electronics Forum | Tue Jan 08 17:29:20 EST 2002 | davef
Your research is on track. NC flux needs to reach activation temperature. Also, do not depend on the corrosion characteristics associated with the flux classification (ie, L1, L0, M1, M0, etc.), until the flux is activated by exposure to soldering
Electronics Forum | Tue Nov 09 10:35:02 EST 1999 | WilDaly
Tim, I try to get 2-3 degrees C/sec (bottomside) rise on my boards through wavesolder. I like to get the topside to about 90-95 degrees C, but this is the optimum temp for the flux that I am using. To fast of a slope and you will burn your flux of
Electronics Forum | Mon Apr 16 12:59:51 EDT 2001 | Mike R
If you will place a temperature strip on the board during wave soldering process you will get a max of 210 F or 98.8 C which is normal on the standard wave temperature. The problem on the 10% solder on the TH via hole can be caused by insufficient fl
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Wed Sep 22 02:45:23 EDT 1999 | Brian
| | Dear All, | | | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | | | I mean that I wonder
Electronics Forum | Tue Aug 22 08:52:39 EDT 2000 | genesmelik
Good morning Dr. Lee. I was wondering how flux chemistries have changed, or will change, with the transiton to Pb-Free, given the higher reflow temperatures required for SMT assembly?
Electronics Forum | Thu Aug 28 09:30:20 EDT 2008 | patrickbruneel
Omid, No-clean fluxes need to be used right out of the can without thinning. In the past with RA and RMA fluxes you could adjust or thin them to your desired density because they had plenty of solids up to 30%. No-Clean fluxes have a lot lower solid
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Electronics Forum | Fri Mar 13 18:06:08 EDT 2015 | caurbach
I'm not familiar with any "test socket cleaners", but I will tell you that water soluble flux is designed for a soldering application so it requires heat to activate. Not sure how effective it would be at removing oxides at room temperature. Second
