Electronics Forum: flux design (Page 1 of 48)

no-clean flux vs. impedance

Electronics Forum | Tue Feb 19 08:49:34 EST 2008 | rgduval

Get the ionic specs from your flux manufacturer, and show it to the designer. No-clean flux/solder is supposed to be low to minimal in ionic contamination, which allow the whole no-clean thing. If he needs further proof, you can have the board io

Re: VOC free flux

Electronics Forum | Wed Apr 19 13:32:51 EDT 2000 | C.K.

Dave: The main part of your machine that VOC-Free fluxes attack is your spray fluxer itself. If you haven't already, you'll need to purchase a spray fluxer that's designed to accomodate water-based VOC-Free fluxes (i.e. made of stainless steel with

no-clean flux vs. impedance

Electronics Forum | Mon Feb 18 17:36:32 EST 2008 | kennyg

I should have mentioned... the only flux we use for the hand soldering is wire-core, no bottle flux. I think it should be a non-issue to leave the activated wire core flux residue. I'm just looking for some way to prove it to the designer.

Wave flux and profiling

Electronics Forum | Sun Dec 17 18:14:12 EST 2006 | greg york

circuitmaster designs prowave is unbeatable. They may have an agent in the usa if interested I will try to find out for you. cheers greg

no-clean flux vs. impedance

Electronics Forum | Wed Feb 20 12:22:39 EST 2008 | shrek

KRIKIES, a designer insisting on cleaning no-clean residues! the BLAME-THE-PROCESS bandwagon travels everywhere, me lad!

no-clean flux vs. impedance

Electronics Forum | Mon Feb 18 15:47:42 EST 2008 | ck_the_flip

In theory, no clean flux residues are electrically benign...period. Here's a good test. Subject the board to some moisture/humidity, and have your circuit designer ohm-out any areas that may be affected by conductive material. Option B: Have a la

no-clean flux vs. impedance

Electronics Forum | Mon Feb 18 15:20:43 EST 2008 | kennyg

A PCBA contains a couple of parts that are not sealed and can't be water washed. We hand solder these with no-clean after everything else is water washed. The designer says the no-clean residue must be completely removed so that it will not affect

Vapor/ensolve flux cleaning

Electronics Forum | Wed Apr 28 12:08:02 EDT 2010 | tjg

Our latest designs are flip chip on flex based and we have issues with delamination/blistering. We know it is related to our vapor solvent (n-Propyl Bromide based) attacking an inner layer adhesive. Has anyone else ever heard of something like this?

0201 Aperture design

Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy

Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p

cleaning of no clean flux

Electronics Forum | Wed Aug 10 08:10:39 EDT 2005 | davef

Comments are: * Sounds like it's necessary to clean "heareous F381, F352 no clean solder paste" in your application. Consider a paste that may be better suited to your application. * If you're cleaning "low residue flux", consider using an organic ac

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