Electronics Forum | Thu Apr 20 08:49:08 EDT 2006 | Chunks
a) Is there a recommended dip or dwell time for the dip soldering? Check your data sheet for the part. Dwell time is everything in selective soldering. Top side wetting is a good process indicator. b) How do we improve the solder coverage in the
Electronics Forum | Wed Apr 26 10:21:09 EDT 2006 | slaine
Hi you need to dip long enough for the temperature of the part being soldered to reach about 20 degrees above liquidus of the solder. For the small parts we dip solder we had Sn62 and SAC387 baths set to 250 degrees and this seems to work best for us
Electronics Forum | Wed Apr 19 04:41:42 EDT 2006 | ge_lim
Hi I am using selective soldering to dip soldering the connector pins to the PCB and would like to know your experience: a) Is there a recommended dip or dwell time for the dip soldering? b) How do we improve the solder coverage in the TH? c) How t
Electronics Forum | Mon May 09 10:52:29 EDT 2005 | patrickbruneel
Hannu, First and for all I have a problem with your question "tried and trusted" for the simple reason that you are going to change too lead-free. Ultrasonic soldering or welding is not new, as far as I know it is only used applying the ultrasonic
Electronics Forum | Mon Jan 30 19:27:50 EST 2017 | jgo
Hi all, I'm wondering how does one decide to use flux dipping or solder printing when it comes to be attaching CSPs onto the board? Solder printing has an advantage in that there will be a higher throughput on the mounter as there is no flux dippin
Electronics Forum | Wed Feb 01 02:39:16 EST 2017 | jgo
80 micrometres (0.08mm)
Electronics Forum | Tue Jan 31 09:10:04 EST 2017 | Rob
Hi Joshua, We've done both, but a lot depends on what soloution your machine vendor has, and how good it is. Can you add it into your machine acceptance criteria? Rob.
Electronics Forum | Tue Jan 31 19:34:11 EST 2017 | jgo
I have solder bumps diameters @ 80um, the board pad size @ 100um. Can this size be printed? How about dispensing?
Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto
If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci
Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
