Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian
We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level
Electronics Forum | Mon Feb 16 20:47:46 EST 2004 | davef
Removal: Run the board through the reflow oven with the cooling zone turned off. Then pick the QFP with a pair of tweezers. Replace: Don't clean the solder from the QFP. Just dip them in tacky flux, place the component, and reflow.
Electronics Forum | Tue Nov 15 10:19:27 EST 2005 | James
Can I dip the populated board in flux and achieve good results? Also how easy is it to clean the flux off the board afterwards if it is waterbased? Do you simply brush the board with a damp brush or spray some remover on the board? I also have this q
Electronics Forum | Wed Nov 16 09:22:24 EST 2005 | chunks
These are all good questions. Dip fluxing is fine. Make sure you let all the remaining flux drip off the board. Letting it drip into the pot will cause a lot of spattering of hot solder � be careful. Dipping the board slowly into the pot should
Electronics Forum | Tue Nov 02 23:34:58 EST 1999 | chartrain
You appear to have two problems working against you at once. One is component lead corrosion that the no clean flux isn't aggressive enough to remove. Do a simple dip and look test. Flux the leads of a component and dip it into the molten solder for
Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Wed Jul 22 15:05:31 EDT 1998 | Dave F
| | | | We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all
Electronics Forum | Thu Nov 04 07:53:45 EST 1999 | Chad Notebaert
Sounds like you have a component problem! I say this because you say the sodler is flowing away from the components (leads I assume) This sounds like none wetting of the component. Do a solderability test on the parts. Take the parts and dip the lead
Electronics Forum | Thu Oct 13 18:00:01 EDT 2011 | spitkis2
>We put paste on the board at SMT to solder them on initially. Then not when they get reworked? When assembling the board, solder paste is applied to the BGA and all other SMT pads since the stencil was fabricated with those openings. If the openin
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
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