Electronics Forum | Tue Jan 13 15:16:12 EST 2004 | drewhmi
A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off.
Electronics Forum | Sun Nov 22 09:36:17 EST 2009 | patrickbruneel
Dave, A low residue/No residue flux does exist that when an excessive amount of flux is applied it would only create a cosmetic problem not a reliability issue. The active ingredients are neutralized by the heat applied in the soldering machine and
Electronics Forum | Tue Feb 10 13:59:29 EST 2004 | Vadim
At times the orange peel effect can be from excess flux improperly removed. Our company strictly provides the service of selctive conformal coating application. We quite often see this. Most times if the board is simply "water washed", or IPA washed,
Electronics Forum | Tue Feb 10 14:02:03 EST 2004 | Maryann
At times the orange peel effect can be from excess flux improperly removed. Our company strictly provides the service of selctive conformal coating application. We quite often see this. Most times if the board is simply "water washed", or IPA washed,
Electronics Forum | Fri Dec 03 15:56:47 EST 2004 | Indy
Hi Everyone, Could someone please tell me - What happens if a N-type connector having chromate coating over silver plating is hand soldering to a PCB. Does the Chromate coating form a compound with silver, Or does it come off while cleaning excess
Electronics Forum | Wed Jan 06 09:38:59 EST 2010 | lynn_norman
Via failure could be caused by cracks in the barrel, or thin plating, or fractures in the traces leading to the vias, . X-ray analysis could pick up a fractured trace and cross-sectioning of the vias could pick up the cracks and thin plating. Secon
Electronics Forum | Wed Sep 19 12:27:56 EDT 2012 | proceng1
Are you sure that you are getting adequate nitrogen flow up through the cap? If your pump isn't seated properly, you may have nitrogen escaping. Also, I have two different height nitrogen bases. The shorter one does not allow as much gas to escape
Electronics Forum | Sun Dec 09 22:54:20 EST 2001 | dburr
It sound you have already discovered to root cause, flux entrapment in the via holes. Short of changing the desing, here are sone suggestions. The main thing is you have to dry out the via holes of the wet flux. Some things to try are: slow down t
Electronics Forum | Wed Feb 20 19:57:27 EST 2002 | davef
THIEVING * Layout: I�d guess the surface area of your thieves is not large enough. The pull from the thief is not great enough to over-come the pull from the connector pins and pads. Consider tripling the size of the thief. As you say, reducing t
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
