Electronics Forum | Fri Oct 25 04:06:56 EDT 2002 | kcngoi
Hi Adam, Excessive heat from soldering iron will left the burn mark of RMA flux. The residue is hard to remove. Suggest to use the Flux pen for better control.
Electronics Forum | Wed May 29 08:43:12 EDT 2002 | zanolli
Various solder metal supplies sell pre-forms as loose individual shapes, usually donuts. The loose performs then are placed on the connector leads. If you have any volume at all, you would want to look at a �shake table� that would vibrate a batch of
Electronics Forum | Fri Apr 26 10:42:28 EDT 2002 | Jim M.
I worked for a telecom company that had sites in the deserts, jungles, mountains and regular built up area's. All boards were built using Aim 291/293 No clean solder paste. (all boards built to Bellcore standard) The boards were coated with Dymax ur
Electronics Forum | Tue Nov 03 16:28:21 EST 1998 | Dave F
| Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem
Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang
Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re
Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef
4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3
Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Fri Jan 15 10:52:27 EST 1999 | John
| Hi all, | | I thought I'd use this forum to ask a couple general questions on fluxes for manual operations: | First - Is it OK to use a wave soldering type flux (specifically OA)? Thinking about activation temperatures and the ramp rate of the wav
Electronics Forum | Tue Sep 24 12:30:11 EDT 2002 | Claude_Couture
I'm just shooting ideas here, but maybe a via hole in the middle of the solder pad would drain the excess solder by capillary force? Or using a tin plated PCB and printing flux only, then place and reflow. depending on the thickness of the tin plati
Electronics Forum | Wed Aug 27 14:38:20 EDT 2008 | rgduval
Does your paste provider recommend a TAL? For the leaded and lead-free pastes that we use, the manufacturer recommends 60 seconds above liquidous. I note that your profile shows the TAL as 30 seconds, which may not be sufficient. That said, tho
