Electronics Forum | Wed Jan 26 20:52:06 EST 2005 | Chua
Hi, I'm going to evalute new solder paste and flux for wave-solder. Appreciate you could advise what are the things need to look out during the evalution. Any recommend step or proper way of doing solder paste and flux evalution. Appreciate your he
Electronics Forum | Mon Nov 07 08:27:56 EST 2005 | chunks
It could be you are drying out your solder paste. Most flux formulations are alcohol based and after a few hours can dry out. This can can lead to dewetting and solder balling as well. Especially if you do not homeplate your R's and C's. A simple
Electronics Forum | Wed Mar 12 10:25:29 EST 2003 | davef
J-STD-001C, 7.2.1 Flux Application says words to the effect of: When an external flux is used in conjunction with flux cored solders, the fluxes shall be compatible. Regardless of whether these are or not flux cored solders, this begs the question:
Electronics Forum | Wed Mar 12 08:03:30 EST 2003 | Surachai
Hi all Pls. help advise. Our board use RMA solder paste (Pb-free Sn96.5/Ag3.0/Cu0.5). Can we use No-clean paste flux (Delta 670S1) in rework process? If it can not be used, why?. Thanks very much for your advice. Surachai
Electronics Forum | Wed Mar 12 09:23:56 EST 2003 | MA/NY DDave
Hi I don't see in your note any particular reasons why you couldn't. If it solders well and passes what ever specifications you are using than everything is OK. If your repair faces some soldering or rework challenges where a more agressive flux is
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Tue Feb 17 01:12:52 EST 1998 | J.H. Kim
In solder bumping in flipchip technology by splder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks
Electronics Forum | Tue Sep 12 07:59:03 EDT 2000 | Kevin Hussey
I suggest not to. You are also adding the flux of the paste that may cause you trouble in the long run. I suggest setting up a reclaim process with you paste vendor, or someone they reccomend.
Electronics Forum | Tue Apr 12 08:25:43 EDT 2005 | davef
Q1 Can anyone explain to me what is the clean and non clean solder? A1 The trend away from CFCs has lead many users to evaluate switching to no-clean soldering processes. The term "no-clean" is actually a common misnomer when used to describe a flux
