Electronics Forum | Tue Aug 26 12:52:04 EDT 2008 | circleprime
I have recently started to use RMA flux (customer requirement) for some of our projects. I am finding that some of my BGAs are slightly off. Not enough to be rejected but enough to cause concern. In the past I have been able to rely on the surface te
Electronics Forum | Mon Mar 06 15:51:38 EST 2017 | bk
The one i've been using on some thermally diverse boards with great success has been henkel loctite mfr 301. It's alcohol based not quite the solids you are looking for but close it's 5.5-6.5 solids and it is no clean.
Electronics Forum | Mon Jan 29 20:25:54 EST 2001 | davef
I know you're talking Humiseal, but this may help http://www.loctite.com/electronics/elec_tech_index.html Conformal Coatings (PDF Documents) "Conformal Coating Overview" (Lester D. Bennington, Senior Development Chemist and David Crossan, Manager
Electronics Forum | Thu May 01 10:51:09 EDT 2008 | realchunks
You need a paste designed specifically for this. They are available. Most have 2% silver in them and higher temp flux so you can reflow at "no-lead" temps. The silver aids in the intermaetalic bond and the high temp flux allows you to reflow the n
Electronics Forum | Tue Jan 13 12:06:23 EST 2004 | blnorman
Can't tell you based on sales, but here's a list I know of: Kester Alpha Metals Aim Indium Multicore (Henkel/Loctite) Qualitek
Electronics Forum | Mon Dec 21 11:28:47 EST 2009 | lynn_norman
We used Loctite 3609 and never had problems. If memory serves me isn't 3606 a screen print adhesive? First thing I would check is the cure profile of the adhesive. If it doesn't develop full adhesion, could be problems. Nuther question is are you
Electronics Forum | Tue Jun 03 21:50:57 EDT 2003 | yukim
A question regarding the rampup slop: as we cannot make the preheat time long enough due to our reflow oven limits, a Loctite technician suggested we increase the rampup slope, between the initial point (25C) and 80C, to 4C/sec, as between these temp
Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac
Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a
Electronics Forum | Mon Dec 02 13:55:49 EST 2002 | stepheno
Where I worked we used a different chip bonder. When we had trouble with flux entrapment in the epoxy from the wave solder, we checked the date of the epoxy. The tube didn't have one but the manufacturer gave a shelf life of 6 months and then the s
Electronics Forum | Wed Feb 07 16:16:10 EST 2007 | mr
I have seen this before. Check: --Vibration of belt --Interference (part getting "brushed off" while reflowing bottom-side components --Some glues' cross-linking mechanism is impaired by the flux during migration in reflow, redering the glue useless
