Electronics Forum | Fri Nov 15 11:03:48 EST 2019 | rgduval
I think Steve is on to it. The wire is not getting hot enough to wet. Either the solderer is attempting to solder too quickly, or the PTH is connected to a ground plane. The solder sticking up through the hole leads me to think it's connected to a
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Mon Mar 20 16:47:13 EDT 2017 | u4bga
We're currently using no-clean flux (SR-12) in a no-clean manual soldering process. The brownish flux residue impedes direct visual inspection of the solder joints. Therefore, we're forced to clean the residue off. (1) Is there testing we can do
Electronics Forum | Thu Feb 07 12:50:21 EST 2019 | gregcr
Hi All, What are you running for selective solder flux? I'd like any opinion on water soluble and/or no-clean fluxes you are using. In our Kiss 104 machine we use HYDRO-X20 water soluble flux, per the original install suggestion, but I'd like to k
Electronics Forum | Fri Feb 08 10:52:24 EST 2019 | roblackey
BLT 31-41 "No Clean Selective Flux For Aerospace" On a Versaflow 3/45 Atomises well, good hole penetration, good wetting, cleans off well in the solvent cleaner. Use for SN100C, SA0307, and 60/40.
Electronics Forum | Wed Feb 13 13:30:03 EST 2019 | emeto
I personally prefer a NC process if I have to chose. AIM flux was good NC377 I think(they keep changing names), NF 372 from and many more. You can make them all work...the KISS 104 ...
Electronics Forum | Fri Mar 22 14:19:38 EDT 2019 | gregcr
Thank you ProcEng1 Nordson sent me a flux suggestion list: No Clean: 1. Kester Select 10 2. ALPHA EF-2210 3. AIM FX-16 Water Sol: KESTER 2331-ZX Nozzle Tinning: SUPERIOR #75
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Fri Mar 22 14:07:00 EDT 2019 | proceng1
I believe that NORDSON now recommends AIM NC277. Nordson bought out ACE-protech.
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