Electronics Forum | Thu Aug 05 12:20:06 EDT 1999 | John Thorup
| | | | | | | | | | | | | | | Hello, | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem
Electronics Forum | Wed Jul 29 20:53:44 EDT 1998 | Dave F
| Howdy all- | Does anybody have any experience with solid solder deposits as an alternative | to paste deposits? I have heard many good things, but do board fabricators have | the technology to do this? Where can I get more information on ho
Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan
Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use
Electronics Forum | Mon Aug 17 02:57:47 EDT 1998 | Bob Willis
| | Looking for Suppliers of surface mount wetting balance equipment. | Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F I like and continue to use the Multicore system. I have had many ours using the sys
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Thu Aug 27 15:40:50 EDT 1998 | Justin Medernach
| | | | | Hi, | | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | | We have rule out the possibility of not p
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
.png)
