Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Mon Jun 14 11:44:10 EDT 1999 | Vince Gedgaudas
Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not causin
Electronics Forum | Mon Jun 15 15:33:51 EDT 2009 | hegemon
IMHO I would suggest that if you are using flux only during a BGA placement on a small run, that you first tin the pads with your soldering iron, then level the pads back out with wick. Accomplishes two things; adds a little metal to the joint to ma
Electronics Forum | Sat Oct 29 20:29:30 EDT 2016 | adamjs
Posting here because all the threads asking for feedback on it are locked. We have been extremely happy with the 4300 tacky flux for BGA attachment. Not only is it both washable and no-clean (i.e. wash-optional), it was also the only tacky flux tha
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Wed Jul 15 12:31:20 EDT 2009 | rwyman
Depending on the end use of the PCB, edge or corner bonding may be adequate. Much easier to rework as the material is only at the perimeter of the part. We don't do underfill of any degree in-house but a few years ago we did build a limited run of
Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F
| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus
Electronics Forum | Wed Sep 08 15:59:25 EDT 2004 | kbayram
Hello, I'm looking for a lower end used machine that can place a 55x44mm sized bga component, placement speed is n't concern. At the moment I have only found the quad ivc to be capable although I'm worried about the placement accuracy and repeatabi
Electronics Forum | Tue Sep 21 09:28:47 EDT 1999 | Jeanjean
Dear All, In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. I mean that I wonder why we use toxic flu
