Electronics Forum | Tue Dec 14 13:26:19 EST 2004 | Peter
I have a question regarding post cured property of SMT adhesive. If after component placement, the epoxy dot gets compressed and bridges between the 2 pads, what would the impact on the circuitry? Would it pose risk for flux entrapment? Could the cu
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Tue Jun 02 07:31:55 EDT 2009 | scottp
Early on when we started looking at BGAs we tried dipping. We've done it in production for a couple decades with flipchips. Dip fluxing BGAs worked fine in the lab but we ended up starting production with screen printed flux for cycle time reasons.
Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe
We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you
Electronics Forum | Mon Jul 25 06:12:53 EDT 2005 | lloyd
Folks thanks for all the info, I'm gonna check out our pad geometries and see how they compare with industry standards. Brian, could you elaborate a bit more on the stencil design you have mentioned. Do you mean that you have offset the stencil aper
Electronics Forum | Thu Jul 07 18:16:36 EDT 2005 | russ
What size discrete components and have you evaluated your pad geometries? If pads are too far apart this will happen. The flux resudue is simply there because you didn't solder the component. It will stay on top of the solder bump. You can see this
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Tue Nov 04 12:45:54 EST 2008 | smt123
Hi Martin, Have you considered printing the flux with a stencil? Stencils can be used for printing more than just solder paste. Quite regularly people use stencils for printing thermal grease, fluxes, conductive epoxy and more. The thing I like
Electronics Forum | Fri Aug 22 09:44:45 EDT 2003 | davef
Kenny: Since you need to use water soluable flux and can't use no-clean, consider asking your board fabricator to plug the via.
