Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Wed Feb 28 03:57:46 EST 2001 | peterbarton
Are you using a water based flux? Are the solder balls mainly around or near non-plated holes or near the edges of the PCB? If so the preheat must be set so the water content of the flux is fully evaporated before the board hits the solder wave. If
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Fri Oct 13 05:21:08 EDT 2000 | Robert Steltman
Looking at the original post, it seems that the white residue is formed on the board after wave soldering and becomes evident when it has been left standing for a while. From what I understand, it seems that the solids content of the "no clean" flux
Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Tue Aug 26 21:12:24 EDT 2003 | iman
depends if your water wash process is manual or automation? important is the water residue inside the via holes is adequately blown out. As long as the water-flux residue is out, testing down the line should not be a issue, at least from theory and o
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Fri May 31 18:00:55 EDT 2013 | hegemon
With regards to first picture.(Large themal vias) I would attempt to measure the area of the ground pad, less the area of the "drain" holes or Thermal Vias. From that result I would reduce the aperture to account for about 50% coverage of that remai
Electronics Forum | Sun Aug 06 14:02:04 EDT 2000 | David Harper
The company I work has been assembling this particular board for several years now, and one thing has always remained constant. Bad Soldering. The board is a double sided board, the solder side has about 250 1206 caps & resistors and Sot-23 transisto
Electronics Forum | Wed Mar 22 10:29:15 EST 2000 | C.K.
Larry: I've got extensive experience with solder skips on both 0603 and SOT23 devices. We also installed an "Omega" vibrating wave on our machine, but it didn't really have an impact on solder skips. The major difference that the omega makes is in
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