Electronics Forum | Sat Jan 10 10:28:06 EST 2004 | tommy
Is it possible to have zero flux or paste spattering for all smt reflow pcbs. We are seeing around 0.4% of flux spattering and looking forward to zero defect.
Electronics Forum | Mon Jan 12 11:51:15 EST 2004 | Hussman
I don't believe you'll get an exact zero flux with no-clean pastes. Water soluable yes, but I don't see it happening with no-clean; at least not this year. As for spatter, you should be able to control this. Can you define what you call "spatter"?
Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy
We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new
Electronics Forum | Wed Jan 14 08:28:46 EST 2004 | davef
Search the fine SMTnet Archives for background on solder on gold fingers. As we recall: * Paste selection * Proper reflow recipe tuning ... are important.
Electronics Forum | Thu Aug 24 13:09:30 EDT 2000 | Dr. Ning-Cheng Lee
Yes, a flux with a fast wetting rate will be more prone to have spattering. Fluxes with high boiling point solvents are also more prone to have spattering, if the same flux is fast in wetting rate.
Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Mon Nov 19 14:10:13 EST 2007 | realchunks
Hi Taint, Both machines work OK. The big thing you may over look is pre-heat. Things like flux spatter/boil tend to come into play if you don't pre-heat. Change over, ease of programming, and service are also things to think of.
Electronics Forum | Sun May 16 03:38:49 EDT 1999 | Zambri
I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. I don't fa
Electronics Forum | Wed May 19 11:07:25 EDT 1999 | Glenn Robertson
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway
What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi
