Electronics Forum: flux spread (Page 4 of 9)

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 22:36:23 EDT 1998 | Dave F

| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D

Solder splash from component terminal

Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist

Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.

Re: Flux Effect On Solder Surface Tension

Electronics Forum | Wed Aug 23 16:29:16 EDT 2000 | Dr. Ning-Cheng Lee

The surface tension of solder you mentioned should be referred to as interfacial tension between solder and flux. According to Antonow�s rule, the interfacial tension is the difference in surface tension of molten solder and liquid flux. Since flux a

Re: Cleaning No-Clean

Electronics Forum | Tue Oct 13 22:22:14 EDT 1998 | mike

| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux

Re: Wave Solder Dwell Time

Electronics Forum | Mon Nov 06 21:09:47 EST 2000 | Dave F

That's cool that you used the Archive. Consider running a designed experiment on your board, using your flux and solder, the limits from the Archive, and on your machine to dial in the spread in dwell numbers you see in the SMTnet Archives to your s

ENIG poor wetting

Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef

Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e

Coating adhesion problems

Electronics Forum | Tue Sep 21 16:09:08 EDT 2004 | davef

Q1: What is "enough surface free energy"? A1: Look here for background: http://www.azom.com/details.asp?ArticleID=1575 Q2: How do I determine surface free energy? A2: We look at it a relative term. For instance, a semi matte finish on solder mask

Testing potential employees.

Electronics Forum | Sun Feb 29 23:15:14 EST 2004 | Ken

I have found that during the interviewing process you need to include your technical staff to get to the nuts-and-bolts of what your looking for. Plus, team involvement spreads the responsibility for selecting the "right" candidate. Recently duri

Cleaning after repair.

Electronics Forum | Thu Jan 23 20:57:33 EST 2003 | davef

If the flux was not activated (ran in another area of the board), the flux should be removed from the board. Any Comments? A: We agree. In order for its �benigness� to take effect, NC flux is affected by: * Type of flux * Amount of flux * Proper ac

Re: Cleaning No-Clean

Electronics Forum | Thu Oct 15 16:41:28 EDT 1998 | Dave F

| | All Y'll | | | | How do you clean components that must be added to an assembled board after water wash? | | | | BACKGROUND | | | | Our basic process goes like this: | | | | 1 Print paste with OA flux, place, reflow, wash | | 2 Repeat 1 | |


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