Electronics Forum | Mon Oct 25 19:15:41 EDT 1999 | nards
Hello, Is the volume of flux paste critical over reflow temp. profile and belt speed?. thanks, nards
Electronics Forum | Tue Oct 26 16:51:18 EDT 1999 | John Thorup
Hi nards I'm not quite sure what your question is. If you mean is paste volume more important than the reflow profile the answer is no. Belt speed is just a part of creating a reflow profile and all aspects I.E. pasting, placing and reflow are jus
Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Thu Jun 04 19:53:44 EDT 2009 | davef
For low volume work and repair, just use a brush dipped in tacky flux to apply flux to the ball array.
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Sun Dec 11 22:39:36 EST 2016 | ppcbs
We have been using the Amtech line for over 12 years now with all of our PCB and BGA Rework. The NWS-4400 is mildly active and will give better results with Lead Free Solder. Note that the LF-4300 is considered a No-Clean. However it will show lea
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
