Electronics Forum: fluxer

Re: Conformal Coating that doesn't require fancy equipment...

Electronics Forum | Sat Jul 25 11:11:09 EDT 1998 | Mike Moninger

| Be consistant on: | 1 Keeping the coating material thinned. | 2 Using the same dipping motion on each board. Amen on thinning the coating, and you might also be concerned about the curing mechanism for the coating. Moisture-cured and 2 component

solder pre-forms

Electronics Forum | Wed May 29 08:43:12 EDT 2002 | zanolli

Various solder metal supplies sell pre-forms as loose individual shapes, usually donuts. The loose performs then are placed on the connector leads. If you have any volume at all, you would want to look at a �shake table� that would vibrate a batch of

ESD protection

Electronics Forum | Wed Jun 19 00:07:10 EDT 2002 | kenbliss

arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people

ESD protection

Electronics Forum | Wed Jun 19 00:07:31 EDT 2002 | kenbliss

arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people

Thermal resistance of a given copper area

Electronics Forum | Fri Jun 06 18:44:26 EDT 2003 | davef

No, no. It's koscher to have thermal planes. You just need to: * Work with your fabricator to keep the layup balanced. * Relieve the plane so that it doesn't cause assembly problems. While probably not directly for your part, it gives a starting p

Lead Free ...

Electronics Forum | Thu Sep 02 15:45:35 EDT 2004 | russ

We don't do any wave, SMT only. We did not have to change apertures for lead free, we use the same stencil that we did when we ran water soluble with pb. This I think might be dependant upon your current design of both pad and apertures however.

Need Help for EMI Shielding process

Electronics Forum | Fri Nov 11 09:18:28 EST 2005 | chunks

EMI shields are no fun! Your process will depend on your design and condition of the shields. We always break the shields into their own process. Because the shields are never flat, screen printing paste and trying to reflow them only caused huge

Opinions about AOI Machines

Electronics Forum | Thu Jan 19 04:35:35 EST 2006 | pavel_murtishev

Good day, I worked with Maratnz some time ago. My own opinion is that this is limited machine with limited functions. Main disadvantages are: - Rather costly, something about 100 KEUR per table top machine; - 2D scanning system (direct light module

solder paste measurement machine

Electronics Forum | Thu Apr 26 19:06:08 EDT 2007 | grayman

In short this guys are not well updated on the new technology of SPI. True, 3D IN LINE SPI is no longer a slow machine. Try checking some brand like Cyberoptics,Synapse imaging,SEIMENS,KOHYOUNG and many others...they can match the speed os some mount

Questions on underfill process

Electronics Forum | Fri Jun 08 15:37:41 EDT 2007 | ck_the_flip

Jim: I have limited knowledge, but here's what I know: 1. Yes, it's a standard process. In today's SMTNet, it's rarely mentioned, and few people reply to postings. 2. Nope. It's a "specialty" piece of equipment for most CEM's. Depending on you


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