Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS
Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness
Electronics Forum | Mon Jan 21 01:49:18 EST 2002 | chinaren
hello, One of THT connector we used in production line is packed in ESD blister from the supplier, and then the blister is kept in ESD box. and now the supplier wants to change the ESD blister to plastic material( NON ESD) but still in ESD box. whet
Electronics Forum | Mon Dec 15 04:21:08 EST 2008 | bejingaf
Hello! I'm interested if anyone did any comparisions now days betwen several AOI types for inline inspection of populated SMT and THT PCB's. I'm mostly interested in multicamera systems ( MIRTEC, LANDREX, ORBOTECH, VISCOM....). I have checked few of
Electronics Forum | Fri Jan 12 06:45:52 EST 2024 | calebcsmt
When conformal coating a PCB, when it comes to components such as alum caps, if no keep-out specified for SMT, would you recommend coating the entire component, or would you only coat the bottom portion (where conductors/leads are present) Moreover,
Electronics Forum | Wed Feb 12 16:23:30 EST 2003 | russ
I agree with DDave, You have something else wrong! .100 dips with .05" lead protrusion should not bridge (in fact I would think that it would be almost impossible). Tell us about your machine, (laminar flow, A-wave, etc.., size of nozzle, wave heig
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Wed Feb 28 00:12:22 EST 2007 | Muhammad Haris
hi, Consider BGA1= bigger one BGA2= smaller one CONSIDERATION : 1. If bga2 is inside the bga1 then bga1 balls should not touch the bga2 upper surface i.e. the inside balls of bag1 package should b in ur mind, so choice is urs. METHOD: m
Electronics Forum | Fri Feb 22 18:36:36 EST 2013 | austinpeterman
Has anyone experienced bridging on topside (solder destination side) surface mount devices after wave soldering? We x-rayed 100% of the placements after smt re-flow with no issues. When the same placements were x-rayed after the tht wave solder pro
Electronics Forum | Sun Jul 14 04:39:35 EDT 2019 | alexeyzb
I have changed job and now i have some problems. Previous experience was with high volume production and not so high quality level (class 1, 2 according IPC). Now i need to produce very high quality (and very expensive) PCBAs in Low volume production
Electronics Forum | Thu Feb 27 08:59:15 EST 2020 | spoiltforchoice
In both cases, it will depend on storage conditions, unless you do something horrible to them (or as previously mentioned, wash them) months & months. For boards we put through SMT and then stash for THT loading in smaller qty's I don't think we've e
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
3 Road Xintang， Fuhai Street，Fuyong
Shenzhen, 30 China
Phone: 13713862102
