Electronics Forum | Wed Feb 24 01:08:10 EST 1999 | Joe Cameron
Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean sock
Electronics Forum | Sat Jan 11 09:56:15 EST 2020 | jakapratama
There's a lot of parameters to consider in defining stencil life cycle. Average squeegee pressure used, in-process cleaning frequency (auto and manual), physical appearance over time, tension reading over time, and so on to decide how many print cycl
Electronics Forum | Wed Jan 15 03:02:10 EST 2020 | SMTA-Davandran
At least there are method on detection of stencil replacement before it really fail which can safe line down.
Electronics Forum | Tue Mar 23 09:47:45 EST 1999 | Dan Hughes
George, No it does not make sense to measure the tension on a mounted foil, however, if you wish to please your customer you might want to find a tension gauge that measures in mils of deflection. In the beginning, screen tensions were all measured
Electronics Forum | Fri Oct 08 20:23:23 EDT 1999 | Bix
Can anyone tell me the formula/method to determine the amount of weight that solder's surface tension can support. (ie: Maximum weight of components soldered onto a bottom side of a board during a top side reflow on a Paste/Paste process). Thanks, S
Electronics Forum | Fri Feb 26 04:02:16 EST 1999 | Terry Keen
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Sat Oct 09 09:07:48 EDT 1999 | Brian
| | | Can anyone tell me the formula/method to determine | | | the amount of weight that solder's surface tension can support. | | | (ie: Maximum weight of components soldered onto a bottom side | | | of a board during a top side reflow on a Paste/Pa
Electronics Forum | Sat Oct 09 09:18:21 EDT 1999 | Dave F
| | | | Can anyone tell me the formula/method to determine | | | | the amount of weight that solder's surface tension can support. | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | of a board during a top side reflow on a
