Electronics Forum: following (Page 183 of 253)

Re: chip shooter

Electronics Forum | Wed Apr 14 10:53:49 EDT 1999 | Jason Gregory

Jeff, my experience with both turret-style placement machines and split-axis type machines is that the turret-style generates a higher placement rate than that of a split-axis style. The fact that the axes are integrated under a fixed placement site

Re: The SMT Beginning

Electronics Forum | Wed Apr 07 11:53:59 EDT 1999 | Dave F

| Could somebody send me some information about the SMT Beginning? | I mean, when, where, why, SMT starts. | | Thank you, | | Roberto. | Roberto: There�s lots of reasons for getting into SMT. Some of which follow: 1 Manufacturing engineers thi

Re: The SMT Beginning

Electronics Forum | Wed Apr 07 12:54:13 EDT 1999 | Roberto Cardozo

| | Could somebody send me some information about the SMT Beginning? | | I mean, when, where, why, SMT starts. | | | | Thank you, | | | | Roberto. | | | Roberto: There�s lots of reasons for getting into SMT. Some of which follow: | | 1 Manufac

Re: AR vs. UR

Electronics Forum | Fri Mar 26 13:02:18 EST 1999 | Scott McKee

Sorry, in the following message I'm agreeing with Graham - not Greg... | | I am looking into replacing another business division's Acrylic coating process with our Urethane coating process. Unfortunately, MIL-I-46068 doesn't differentiate AR/UR's p

Re: Intrusive soldering

Electronics Forum | Tue Mar 23 04:07:44 EST 1999 | Scott Davies

Rob, We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. - Apply adhesive dots to selected

Re: Intrusive soldering

Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis

| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots

Re: Chip Resistor Failure

Electronics Forum | Thu Mar 25 02:22:32 EST 1999 | P.L. Sorenson - Technical Consultant

| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr

Re: Universal FlexJet!!!

Electronics Forum | Wed Mar 31 13:15:43 EST 1999 | John Doe

| | It's unfortunate that there are corporations that exist that would actually hire and employ people of your specimen. You, obviously by your screen name, GSM GURU!, are a complete idiot. I'd like to see you and your idiot brother C4 GSM GURU ter

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi

Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side

Re: Warning! Somebody is sending virus files!

Electronics Forum | Sun Mar 14 09:33:34 EST 1999 | Wayne B

Thanks Steve: Think I got the same email from "Evergreen PCB" I deleted it without thinking. maybe a good thing. Wayne | Good morning fellow SMTnetters, | | Upon opening my email this morning, I had two emails from the following email addre


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