Electronics Forum: forced routing (Page 1 of 2)

depanelizing with C02 Laser

Electronics Forum | Wed Dec 07 20:51:59 EST 2022 | proy

cut time was very good (not a concern) Main advantage is flexibility and simpler fixturing than routing as there are no side forces. Charing was evident, but can be reduced with a few tweaks.

Re: PCB snap-offs

Electronics Forum | Thu Aug 31 04:25:03 EDT 2000 | Chris May

Dougie, If you have square, rectangular etc; shaped PCB's maybe you could have routing between circuits. "V" shaped grooves top and bottom. I found this extremely good especially if the assemblies are wave soldered. No gaps for flowing up and over.

uBGA Square Pads or Lands

Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t

DEK FormFlex

Electronics Forum | Fri Aug 03 12:13:59 EDT 2001 | hinerman

T.A. board lok is fixed tooling. I have not used it, and therefore cannot comment on it. Their website describes it in detail for those interested. -The Grid-Lok system is completely pnuematic -Each pin locks individually via mechanical lock -Each

Dual lane vs. single lane feeders for high mix

Electronics Forum | Thu Dec 14 04:02:40 EST 2017 | spoiltforchoice

"I would expect that any intelligent feeder > enabled machine would pull the correct part no > matter where it is placed on the machine (not > forced by the program)" > > this is true, but you > have to tradeoff the setup time vs production > t

When does SMT inspection/touch-up become rework?

Electronics Forum | Thu Jan 20 08:08:24 EST 2011 | deanm

Because we build Class 3 assemblies, our company has formal inspection steps on our routes. CCA's go through surface mount and then an operator inspects the solder joints for defects and corrects them (touch-up). Following this they go to formal insp

Very thin laminate substrate problem with solder printing

Electronics Forum | Mon Jan 30 05:58:39 EST 2017 | rob

Hi all, > > Am new to SMT here. > > I have a very > thin laminate substrate which around 120um > thickess. Being that thin, warpage is constantly > an issue for us. > > For the solder printing part, > we have a number of problems. > > Being s

Re: PCMCIA QFP Process Issue

Electronics Forum | Tue May 23 20:44:13 EDT 2000 | Dave F

Sal: You and Wolfgang are spot on, but let's see if we can blow this out a bit. Before proceding to rattle on ... � PC Card. A credit card-size computer peripheral that add memory, mass storage, and I/O capabilities to computers in a rugged, compa

SMT REWORKING ( BGA )

Electronics Forum | Mon Apr 16 09:01:18 EDT 2007 | Steve

The best station I've ever worked with is a focused IR station from PDR. The station that I had was called a; "Lightmaster Pro". They have a different model name now, but you can see a datasheet for it at: http://www.pdr.co.uk/Datasheets/PDRX410-IR-

Re: Peelable solder stop

Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F

| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W

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