Electronics Forum | Fri Jun 07 09:53:24 EDT 2019 | dhanish
How do you perform measurement the placement force for NXT machine?Fuji provide the placement force data by nozzle type.How can we verify the actual force?
Electronics Forum | Mon Jul 24 23:34:14 EDT 2000 | rzkr438
I am tyring to find out shear force requirement for BGA attached on board .I measured two group for shear force to check underfill process effectiveness on BGA .Two group showed siginificant force diferrence .I am very sure underfill process is effec
Electronics Forum | Tue Mar 13 18:13:41 EDT 2018 | dleeper
Placement force usually refers to the amount of force an SMT nozzle applies to a part when placing it. You want enough force to push the component onto the paste but not so much that you damage the part. Some specialized applications involve placing
Electronics Forum | Tue May 28 11:39:52 EDT 2002 | sallyt
Hi Jim, How much force is required to press fit a connector?
Electronics Forum | Thu Nov 29 03:15:44 EST 2018 | bukas
is it vibration or pcb bends under G force? what angle is this force?
Electronics Forum | Fri May 25 15:57:15 EDT 2001 | robert
you should be able to get the force requirements from the connector manufacturer. Both the minimum and maximum forces used in the pressing cycle should be recorded to know the connector is properly seated without excessive force that can damage the
Electronics Forum | Wed Aug 25 12:44:42 EDT 2010 | fdr4prez
I previously did a search on "peel back force" and there were a few results, and there were a few hits that say EIA-481 is the standard, but nothing on what the standard force range is. A search on "cover tape" yeilds many hits about breaking cover
Electronics Forum | Mon Jul 02 04:06:07 EDT 2001 | chinaren
Hello: Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benifits fromthis activity? Thanks with best re
Electronics Forum | Tue Nov 05 00:51:39 EST 2002 | yngwie
How to measure the max allowable force when we press the heatsink at the attachment process. I was posted with question by my customer, " how to I ensure that the force I use to attach the heatsink does not causing any damage to the solder joint on t
Electronics Forum | Wed Nov 24 16:08:09 EST 2004 | Terrapin Station
This depends on the model. Most machines and turret style typically overstroke .2mm with a force of 250 - 300 grams of force. the reason for the over stroke is to place the component into the paste. This can be adjusted through part library manipul
