Electronics Forum: foreign object size criteria (Page 1 of 1)

cp6

Electronics Forum | Tue Sep 01 12:20:47 EDT 2009 | fujiphil

Manually load the board and activate the solenoid for table up/down. Goto I/O then check the status of the sensor. if the sensor was tripped when table is down, removed the pin and check for foreign objects. Or check the hole of the pcb, maybe the si

Solder Iron Tips - Acceptable Temp Tolerance?

Electronics Forum | Sun Sep 02 09:06:42 EDT 2018 | davef

Cold resistance between the tip of the tool and the ground reference, tip current leakage, and tip voltage. per ANSI ESD STM 13.1 J-STD-001 Rev G, Appendix “A” Guidelines for Soldering Tools and Equipment: A-2 BENCHTOP AND HAND SOLDERING SYSTEMS Se

Re: Through holes in SMT pads

Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon

| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

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