Electronics Forum | Sun Sep 08 19:58:57 EDT 2002 | dasal
My specialty. Your right, Most corrugated contains S02 and the pallet is usually out gassing formic acid as well. Not a great environment for silver. Original press release follows: Reactive Polymers At AT&T Bell Labs, John P. Franey has developed
Electronics Forum | Thu Apr 28 11:14:27 EDT 2005 | bbarr
If you apply the RTV after coating, what happens to bond strength since you are now bonding to the coating and not the board? Will the caps still survive vibration and shock? I specify applying RTV before coating for this reason. Am I correct? I als
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Wed Oct 13 04:30:01 EDT 1999 | Brian
Hi! I recently remarked on a thread that so-called VOC-free fluxes weren't. As a result, I got three private e-mails asking what I meant. As this seems to be unclear, I'm starting a new thread with my explanation, rather than sending out the answers
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef
What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Fri Jul 10 07:34:00 EDT 2020 | elijah
From the poor bonding strength of the board, the surface quality problems of the board are divided into: 1. The cleanliness of the board surface; 2. The problem of micro graphite (or surface energy) on the surface. PCB circuit board proofing Youke bo
Electronics Forum | Fri Nov 27 13:04:47 EST 1998 | Phillip Hunter
| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the
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