Electronics Forum | Mon Sep 24 16:04:48 EDT 2007 | flipit
I would look at SST International and Sikama International. You might solder using forming gas. Forming gas is 10% hydrogen and 90% nitrogen or 8% hydrogen and 92% nitrogen. Chris
Electronics Forum | Thu Oct 20 23:01:12 EDT 2005 | davef
A highly activated flux will allow intermetallics to form, because the hydrogen halide gas that formes at operating temperature will react with the refractory nickel oxide. Refractory nickel oxide is what makes SS "stainless". This will be worse wit
Electronics Forum | Wed Jan 10 17:18:11 EST 2007 | flipit
I am soldering a Germanium Window with a > metalized rim to a Ni-Au plated kovar lid. The > solder joint needs to be hermetic. I am using > 80In solder washer shape preform, but am > experiencing lots of voiding when x-rayed, > although the jo
Electronics Forum | Thu Jan 11 00:17:08 EST 2007 | behrsam
Thanks both of you for responding. I am using a protoype reflow oven. It uses a programable controller to ramp the temp up. It has convection and radiative heating. Ultimately yes, I would like to use a vacuum furnace like the sst but it is not c
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Thu Oct 28 11:41:21 EDT 2004 | Steve Stach
Hello Loz, Blue residues on circuit boards can be caused by copper corrosion, component body deterioration, marking permanently, and adhesive break down. In this case, a more subtle mechanism appears to be possible. This is a no clean application
Electronics Forum | Tue Jun 26 16:07:12 EDT 2018 | eduszapata29
Minami vacuum reflow is easy to maintain air tightness, and oxygen can be reduced to 50ppm or less by filling N2 gas. And generation of oxide film can be suppressed, and production in low oxygen environment is possible. In addition to the air tightne
Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0
Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging
Electronics Forum | Fri Jun 12 06:53:54 EDT 1998 | Earl Moon
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
