Electronics Forum: forum (Page 4093 of 7899)

Lead-Free

Electronics Forum | Thu Jun 06 08:23:56 EDT 2002 | caldon

I have not seen any, but that does not mean they do not exist. I do know lead-free is starting to loose its momentum. Compliance dates are being pushed back. And also some of the European standards developments are starting to make exceptions (i.e. m

Lead-Free

Electronics Forum | Fri Jun 07 02:43:35 EDT 2002 | madreindeer

Thanks for answers....In Euroland (My place)it is not so clear.And this is confusing: There is 3 different comittee�s in Europe. First says 1 of January 2007.Second says 1 of January 2006, and third one says that any of these will do. Also we get a

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon

Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta

Factory Lighting - specs and measurement ?

Electronics Forum | Wed Jun 12 10:53:15 EDT 2002 | genny

350 candlepower is fairly low for high detail work. I spent some time in the construction industry laying out electrical blueprints for schools, and such. It was desirable to have more in the order of 700 fc for the desk surface that kids would wor

Recommended board finish for 0402s

Electronics Forum | Tue Jun 11 10:59:08 EDT 2002 | jseagle

Thanks Dave. My engineers are not going to like the news but it's good for me. Maybe now they will use 0603s instead of the 0402s which are not required due to plenty of board space being available. They want to do 0402s just because we now have a

Recommended board finish for 0402s

Electronics Forum | Tue Jun 11 12:08:43 EDT 2002 | davef

It's like Mom used to say, "Just because you CAN hit something hard with the thing that you use to think, that doesn't mean you SHOULD do it." [Er, words to that effect.] If your engineers feel a need to develop 0402 process, maybe they should cons

Production Line Setup

Electronics Forum | Fri Jun 07 17:27:50 EDT 2002 | nuezmaster

I am having some diffuculty convincing our exec. staff that by increasing our personel on the floor, we will actually improve our machine efficiency. We currently have seven lines, four of them have two P&P machines in line. At this point there is

Production Line Setup

Electronics Forum | Wed Jun 19 18:41:52 EDT 2002 | nuezmaster

Our plan right now is only to increase production on the products that we are behind on. Since we are currently running three shifts with seven assembly lines and only adding six people (3-Days, 3-Nights), it averages out to about a 20% increase ove

force between the pad and laminate material

Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao

according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,

Tombstoning

Electronics Forum | Wed Jun 12 03:26:03 EDT 2002 | edahi

We are currently having gross tombstoning with 0402 capacitors. We are using HiPb Solder Paste mounted on Laminate substrates. We are assembling Flip Chip BGA's. Temp @ Reflow is around 230-240 C to meet the thermal requirements for both die bump


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