Electronics Forum: forum (Page 4520 of 7902)

EPROM OR OTP ICs issues

Electronics Forum | Fri Feb 09 02:41:12 EST 2007 | Muhammad Haris

1. Can X-Ray Inspection System damage the EPROM OR OTP during inspection after Reflow? 2. At 300 degree Centigrade, program in the EPROM OR OTP disturb. Is that true? 3. Sometimes, if some ICs couldn�t program first time then I put that IC in oven

A BGA reports (RoHS related of course)

Electronics Forum | Tue Feb 13 14:33:16 EST 2007 | CK the Flip

So the moral of the story is..... these SAC305 BGA's were accidentally mixed in with a Leaded process, the profile couldn't get hot enough due to Tg and Td constraints on a known good QFP on the same board, and consequently, the whole assembly fail

ipulse M4e surface mount machine

Electronics Forum | Fri Feb 09 16:04:56 EST 2007 | tiucric

Firstly , we are installing an ipulse m4e smt machine later this year. If any are being used in your production process please let me know just how good or bad the machine operates, any advance of information regarding problems : placement , nozzles

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 13:01:09 EST 2007 | campos

Hi all,, I running SMQ230 solder paste with a time above = 40sec with peak temperature = 239 degrees .. the complete reflow takes almost 6 min with a slope (150to190) close to .60 degrees/sec .. may I have some concern about that or it's ok?? tks..

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 13:15:14 EST 2007 | realchunks

Does this meet the SMQ230 recommended time above liquidous? Do you have any parts that cannot withstand 239 degress C? If meet SMQ230's recommended time and temps and your parts are rated for this temp, then you should be OK. The real proof is ref

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 13:58:10 EST 2007 | campos

Tks for the answers,, My concern is about the intermetalic layer,,I run SMQ230 LEAD FREE paste.. its liquidous at 217C..the oven have 7 zone, but I run in 5 zones also with a more agressive profile (due to the line rate)..I would like to know if runn

simple doubt about reflow profile

Electronics Forum | Mon Feb 19 08:00:46 EST 2007 | ck_the_flip

Darby, thanks for the good info. I actually read an article is Circuits Ass'y that a more rapid cooling rate results in "better diffused tin rich clusters" resulting in better grain structure. But...this article was written by an Oven manfuacturer

simple doubt about reflow profile

Electronics Forum | Mon Feb 19 08:18:03 EST 2007 | realchunks

That's why you have to read between the lines of any article. Even with data from a paste manufacturer, it's still a bit fuzzy on how their paste will actually work. Not many companies have their data that solid, so it's better to experiment and me

DEK pro-flow

Electronics Forum | Mon Feb 12 15:57:25 EST 2007 | pr

Anybody out there using this with lead free paste and willing to share the good and bad? I used them a few years back and had some issues (wasted paste, paste bleeding out around the skids). Just curious if DEK has addressed those problems and how cu

DEK pro-flow

Electronics Forum | Thu Feb 15 15:54:19 EST 2007 | pms

pr, I don't believe there is a differance in performance of the ProFlow head between "Leaded" and "Lead-Free" paste. We have been using the ProFlow for about 4 years now with leaded paste. Yes, some issues to overcome. Mostly in the brand/type of


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