Electronics Forum | Wed Feb 16 05:09:30 EST 2000 | Dean
You might try a no HASL spec on your fids...but shelf life may hamper copper quality. Not a pleasant situation...opertors tend to polish the fids with erasers to compensate but this leads to eraser "bits" in your equipment and your solder! Maby op
Electronics Forum | Wed Feb 16 05:58:12 EST 2000 | Wolfgang Busko
Hi Dane, if with "dome" is meant the irregularity of a HASL finish than we had a lot of problems especially like Dean mentioned with finepitch parts and circular fids. It ended up with cleaning the fids with erasers before using the boards. Later we
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Tue Feb 15 14:25:08 EST 2000 | Sergey
Dear Sirs Good business day! I need the following feeders for CSM60 machine: - Stick feeders: 1. 20 mm x 1 2. 13 mm x 3 3. 8mm x 7 - Tape feeders: 1. 16 mm, 9" x 7 you seems to be have not this 2. 24 mm, 9" x 3 3. 32mm, 9" x 1 - Manual tray feeder
Electronics Forum | Mon Feb 14 12:39:41 EST 2000 | Dave F
Francois: Sound like a messy process to me. Choice #1: Put only SMT parts on the primary side Choice #2: Put only SMT parts on the primary and secondary sides Choice #3: Put only SMT and PTH parts on the primary side Choice #4: Put only SMT and
Electronics Forum | Tue Feb 15 13:16:02 EST 2000 | Rob Fischer
Don't feel alone. Many assemblers have the same problem but aren't fortunate enough to have say in the design of the board. They're either have a capital invedtment in a selective solder machine or pallets designed to mask bottom-side SMD. The pal
Electronics Forum | Thu Feb 17 10:14:40 EST 2000 | Jim N
We bulid many boards with fine pitch on solder side and then wave. We use a wave fixture that is custom for each board. The fixture covers the SMT components and only exposes the PTH lead during the wave process. It requires about .070 to .100" clear
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Mon Feb 14 08:41:36 EST 2000 | Graham Naisbitt
Chris, With thanks to Eyal, this is Graham Naisbitt (NiceBit? - Talk to Eyal later!) We can indeed offer you semi-automatic equipment from around $8K US. Your budget is really low, we have to make a living too you know. However, this equipment do
Electronics Forum | Fri Feb 11 15:33:52 EST 2000 | Steve Thomas
We're considering an ENIG finish on some of our boards to resolve some coplanarity concerns with 20 mil pitch QFP100s. I welcome any comments on the subject, especially regarding solderability and the variables of ENIG that affect it, but would part
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