Electronics Forum | Mon Feb 06 09:17:35 EST 2006 | Cal Kolokoy
Mike did you have these SEM'd to be able to see the IMC's within the solder joint?
Electronics Forum | Wed Feb 01 17:07:15 EST 2006 | Chunks
It does work. I tried it myself back in the day. You might look at used equipment to find and automatic flux density machine.
Electronics Forum | Tue Jan 31 13:55:56 EST 2006 | samir
Anyone know what the general rules / requirements are for micro-BGA's and CSP's as to when capillary underfill is required? (ie size of bump/ball, package thickness, PCB/CSP thickness ratios, etc).
Electronics Forum | Tue Feb 07 08:07:18 EST 2006 | amol_kane
I am looking at both totech and McDry.....both are at par with features....McDry is marginally more expensive than Totech
Electronics Forum | Tue Jan 31 13:20:15 EST 2006 | mgdrouin1
Does anyone have any information regarding damaged caused to components due to overheating primarily with a heatgun? I'm having a hard time getting engineering to comply. Thanks
Electronics Forum | Tue Jan 31 13:22:15 EST 2006 | mgdrouin1
Does anyone have any information regarding damaged caused to components due to overheating primarily with a heatgun? I'm having a hard time getting engineering to comply. Thanks
Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser
We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa
Electronics Forum | Tue Jan 31 14:14:03 EST 2006 | samir
Ah, yes. The age-old battle of Production Supervision versus Process Engineering. I guess you just need to tell your Process Engineer, "Pretty please with sugar on top, investigate this f*cking issue."
Electronics Forum | Wed Feb 01 08:18:28 EST 2006 | slaine
RS sell a heat cun that is fully temperature adjustable buy one of them and pre set it to the right temp then put a calibration sticker over the control.
Electronics Forum | Tue Jan 31 15:44:08 EST 2006 | John S.
We're looking at lead free surface finishes for some of our products. On one supplier's site, I found a note that tenting vias on ENIG boards can lead to the black pad phenomenon. How does this compare to your design guidelines and experience? Than
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