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Component Failure caused by Hot Air Knife

Electronics Forum | Wed Sep 20 15:51:19 EDT 2000 | John

We are considering retrofitting our Vectra wave soldering machine with a hot air knife. I've run our problem board on a machine with this option and it does seem to work; however, there is a concern of component failure due to thermal shock. Is thi

RF surface mount assembly

Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau

RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have

Re: RF surface mount assembly

Electronics Forum | Thu Sep 21 20:29:54 EDT 2000 | Dave F

Tanx Beyond keeping one in hot water, I found that this subtile approachs virually assures that you don't get promoted to the point that you get an opportunity to ruffle the feathers of the pimadonnas. Musta breathed too much flux fumes!!! Don't

Re: Capability Study for Solder Printing Process

Electronics Forum | Thu Sep 21 10:07:53 EDT 2000 | Mike Rowell

Hello Sophia, I am an applications engineer for Speedline/MPM. I'd be happy to help you with your questions. feel free to e-mail me or contact me at Speedline/MPM. There are many factors that could cause problems with the print process, I would pref

Re: Capability Study for Solder Printing Process

Electronics Forum | Thu Sep 21 20:22:14 EDT 2000 | Dave F

Mike: Why not hold this conversation on-line, so that we can all benefit? That's really one of the purposes of forums like SMTnet ... free flow of information for the benefit of all. Not a place where sale-types can develop contacts. Right??? Wh

Re: Capability Study for Solder Printing Process

Electronics Forum | Fri Sep 22 08:04:34 EDT 2000 | K.T

I 100% agree with Wolfgang. No matter how many in line or off line inspection gadgets, zillion $ printers, and top of line stencils you use, bottom line is a properly trained machine operator who gives a rat about his/her job that makes the differenc

Re: Capability Study for Solder Printing Process

Electronics Forum | Mon Jan 22 11:35:16 EST 2001 | kirks

Hey Mike, what do you recommend for PCB cleaning if there was a mis-print during the screen printing process. Currently we are hand cleaning them with a SMT solution but are having problems with solder balls in the via's and joints. What cleaning mat

Re: PCB Material

Electronics Forum | Wed Sep 13 20:58:50 EDT 2000 | Dave F

If you don't know what you have, how the blank are we sposed to tell you? Try your local fab. CEM1 - Opaque tan CEM3 - Translucent FR2 - Opaque brown FR3 - Opaque cream FR4 - Translucent FR5 - Translucent FR6 - Opaque white G10 - Translucent G11 -

Re: PCB Material

Electronics Forum | Thu Sep 14 09:53:09 EDT 2000 | John Thorup

Cheap and beige = CEM1 Dave has good advice. Go to a fab that you use and ask them. My concern is that you are not getting enough documentation to do your job correctly. If your customer expects you to duplicate a sample they had better spec what th

Re: Butt-joints

Electronics Forum | Wed Sep 13 20:49:54 EDT 2000 | Dave F

Why not form them as gull wings? Butt joints are undesireable for the very reasons you mention. Further, why the hey are you doing this? By the time you get done putzing around with this, you won't save dip. Just go out and sell those crappy DIP a


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