Electronics Forum | Mon Oct 29 14:52:58 EST 2001 | kjmcbi
We have made a number of step up adhesive stencils using a new material called Cirlex. This material demonstrates excellent release characteristics and is easly cleaned. Typically the glue printing is after the solder printing. The stencil is all las
Electronics Forum | Tue Oct 30 08:55:54 EST 2001 | Stefan Witte
Chris, I should have read your request more carefully. .010" glue dot diameter would require at least .005" needle diameter. No way you can do it with the above mentioned machines. You are already stretching the capability of glue machines for 0402 c
Electronics Forum | Fri Nov 02 20:23:58 EST 2001 | caldon
You may want to also try MRSI. They have awsome machines for bridging the gap between Semiconductor and SMT. They have an excellent research group and can answer a mojority of your questions. http://www.mrsigroup.com they are located in Mass, USA. Da
Electronics Forum | Tue Oct 30 10:54:37 EST 2001 | slthomas
Hey, Preacher, choir here. Unfortunately I didn't get to make the call here (hot boards, new product, same ol' same ol'), but I dam* well am looking for future (print) backup to assist in persuading the bottom line guys that it's cheaper to wait for
Electronics Forum | Thu Nov 01 13:08:33 EST 2001 | dave231
I am just starting to get into sub 50mil pitch, but from what I can see you are correct. But I can help with solder stencil. I cut the width only half of what the pad is, but the keep the length the same. This has helped but does not fix always. Stil
Electronics Forum | Thu Nov 01 00:32:14 EST 2001 | ianchan
we bake boards 80~120 deg-C @1hr, after in-line DI wash. oven setting to 90 deg-C, as +/-5 deg-C, tolerance against door open/shut fluctuations = "temperature loss". If anyone has evidenced procedure, that shows no need for baking, pray do share wi
Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
Electronics Forum | Thu Nov 01 06:08:42 EST 2001 | John Paul
Hi,Just wondering about the usage of diaster recovery planning for engineering.Due to the current climate we have been asked to develop a plan by a major O.E.M customer. just looking for input from other sites on the layout, proceedure etc. Risk ass
Electronics Forum | Thu Nov 01 17:37:23 EST 2001 | davef
Try: http://www.bcpa.org/ http://www.drj.com/ http://www.fema.gov/library/bizindex.htm http://www.drj.com/new2dr/samples.htm NeoSafety (http://www.neosafety.com) Crisis Manager: Business Interruption Recovery Tool. Designated as a "Best Practices" so
Electronics Forum | Thu Nov 01 15:14:47 EST 2001 | jacob
Hello, I am trying to convince our design engineer to use micro-vias when he has to locate them in the middle of a pad. I heard of the use of micro-vias on this site and was wondering if someone could lead me in the direction of somewhere
