Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Mon Jan 15 11:45:39 EST 2001 | bdoyle
Hi guys, thanks for the feedback! Wolfgang - we're looking into making this forum similar to the old one (displaying messages instead of just threads on the forum homepage). In the meantime have you checked out the feature "While You Were Out" whic
Electronics Forum | Tue Jan 16 09:23:26 EST 2001 | P.Gerits
Hello, Standard way to calculate stencil design can be done as follows: A normal ratio of aperture width/stencil thickness = 1.5 for pitches below 650u A normal ratio of stencil aperture width against pad width = 0.8-0.9 (or stencil aperture 10%-20
Electronics Forum | Tue Jan 16 14:53:24 EST 2001 | davef
Yanno what's interesting on that topic? A small number of voids make the solder connection of a BGA stronger than no voids. Moral of the story ... don't get too anal about voids. You should check the archives ;-) [har har har] we've discussed this
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Tue Jan 16 21:27:56 EST 2001 | davef
No we do not use such a storage unit. We say our preferred environment is within: * 30%RH / 84�F * 30%RH / 72�F * 70%RH / 78�F * 70%RH / 68�F J-001C says [words to the effect of]: * At 30%RH and below you�d better make sure your ESD control program
Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
Electronics Forum | Tue Jan 23 20:53:51 EST 2001 | davef
Sorry, not much help for me there. More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the boa
Electronics Forum | Tue Jan 23 10:57:54 EST 2001 | mdaley
Hello, I'm currently in the process of determining the best way to place bare die (flip chip) on our substrates. I've seen the Hover-Davis DDF and was impressed by it's capabilities. I particularly like the fact that I won't incur the cost of packa
Electronics Forum | Thu Feb 01 12:46:19 EST 2001 | cebukid
conveyor speed x dwell time = contact length and =====> inches / seconds x seconds = inches. First run your pump at a constant speed.....THEN,.... try running your glass plate at a very fast speed, and then you'll notice that your lengt
