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Electronics Forum: forums/index.cfm (Page 6877 of 7912)

Time to Setup a New Assembly Line

Electronics Forum | Sun Aug 20 21:43:19 EDT 2006 | darby

Yes, I agree with guest. Lay it all out with masking tape on the floor. Include the width of feeders sticking out. Confirm the position of power, air, network and smema connections. You may even want to use cardboard layed out on to the floor. You ha

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS

Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125

Solder Ball After Reflow Process

Electronics Forum | Wed Aug 16 03:48:24 EDT 2006 | umar

Hi All SMT Net Team Member, I always have problem at MY SMT process and production side, Every time product running at my production side always found a lot solder Ball issue near the pad of SMT chip component. We had quite hard to do the trouble s

Solder Ball After Reflow Process

Electronics Forum | Wed Aug 16 13:52:24 EDT 2006 | russ

Oven settings are meaningless here. What does the board see? It is the paste we are concerned about not what the heaters are running at hehe. These solder balls are at the end of pad, which end? under the part or away from the part. I believe you

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 00:23:21 EDT 2006 | umar

Hi SWAG/Rush/Steve, Thanks for your response, Currently I am running with 811 lead paste. Actually this problem not only effect for one assy. I got 700 models runing at my company, but almost 50% of the model I have problem with solder balls issue.

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 07:37:13 EDT 2006 | Chunks

Hi Umar, I believe you either are over printing these pads or the alignment of board and stencil may be off. Check your print right after your screen printer to verify either. If you are not over printing and your paste alignment is spot on, then

Solder Ball After Reflow Process

Electronics Forum | Sat Aug 19 14:12:13 EDT 2006 | Wave Master Larry

LISTEN I'll have to disagree Steve.i think this Chunks person oversimplifies stuff and I dont like her style I'm surprised because most orientals do better with analyzing stuff.reminds me of some engineers at my place of employment.Again Im fighting

Solder Ball After Reflow Process

Electronics Forum | Mon Aug 21 08:34:09 EDT 2006 | Chunks

Larry, You always seem to twist things back to your wave solder process, ya nut! Anyway, why over simplify things when you are trouble shooting a process? The K.I.S.S. process was invented by your generation so I thought you of all people would l

Solder Ball After Reflow Process

Electronics Forum | Mon Aug 21 10:17:08 EDT 2006 | Wave Master Larry

LISTEN I loose track of all this politically correct business and dont really know anymore who is what and what is who.do I say black or african american oriental or asian.I dont know anymore! In my generation we could say just about anything without

Solder Ball After Reflow Process

Electronics Forum | Mon Aug 21 11:58:54 EDT 2006 | Chunks

I believe you need to try to initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning corridor specified in our strategic initiative. Once bilateral goals are e


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