Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Fri May 20 03:14:03 EDT 2016 | designhaus
Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our ma
Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Thu Jan 12 11:45:18 EST 2006 | patrickbruneel
Noah 2005 In the year 2005, the Lord came unto Noah, who was now living in the United States, and said, �Once again, the earth has become wicked and over-populated, and I see the end of all flesh before me. Build another Ark and save 2 of every liv
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
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