Electronics Forum: fpga quality control (Page 10 of 39)

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:18:27 EST 2004 | Simon UK

Hi Dennis, It is all dependant on what you state for the class of product i.e. Class 3 is the top end acceptance criteria used mainly in Aerospace and Military. You have 2 terms you need to grasp to avoid confusion. 1. Acceptance Criteria 2. Target

defects in pcb manufacturing

Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse

Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo

Help understanding something about stencil orientation when printing

Electronics Forum | Tue Nov 08 12:05:57 EST 2016 | aemery

Lachrymal, Where are you getting that from. Let me keep this simple because there can be so many variables in modern printing, some you can control and some you can't. Unless you are designing your own PCB's where you can decide how to orient the co

No such thing as a Compact Reflow Oven?

Electronics Forum | Tue Mar 20 05:19:20 EDT 2018 | robl

What pick and place machine? Depends where you are. If in the UK or Europe and on a tight budget I would go for an old Philips/Assembleon Topaz, but only because I know the machines and where to buy them cheap, good freelance engineers and a good lo

Precious Metals [Gold, Silver] Plating Insights

Electronics Forum | Fri Aug 07 18:32:57 EDT 2020 | mvogttech22

Hi SMT members, New member here. I have a few questions about the industry standard coating processes to help me investigate if our R&D company's technology would be valuable for your industry. 1. How crucial is the quality of the coating proce

How to prevent BGA issue of SMT solder resist when fabricate PCBA

Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3

To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads

Re: Sub-contractor selection

Electronics Forum | Wed Jul 07 22:12:26 EDT 1999 | Dreamsniper

| | | | We are looking for some subcontractors to do surface mount | | | | technology boards for us. Is there anything I should pay specific | | | | attention when I visit the subcontractor's site? | | | | Thank you for any advice | | | | | | |

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 12:13:16 EDT 2000 | Steve Thomas

I'd like to respond here not just to throw in my $.01 (I yield at least a penny to the more knowledgeable contributors), but to verify that my thoughts on this are reasonable... How about, you either do in-process inspection or testing, or you valid

the perfect SMT line configuration

Electronics Forum | Thu Sep 28 12:33:01 EDT 2000 | Elfego Sanchez

Hi! Guys. I'm working in a SMT area and I want to have the best SMT line. What I want to know is: what would be the line configuration of a perfect SMT line?( automated solder printer-visual or automatic paste inspection-chip placement machine-IC pla

the perfect SMT line configuration

Electronics Forum | Thu Sep 28 12:32:27 EDT 2000 | Elfego Sanchez

Hi! Guys. I'm working in a SMT area and I want to have the best SMT line. What I want to know is: what would be the line configuration of a perfect SMT line?( automated solder printer-visual or automatic paste inspection-chip placement machine-IC pla


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