Electronics Forum | Tue Sep 21 12:57:01 EDT 1999 | Chris McDonald
| | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | Thank you. | | | |
Electronics Forum | Tue Sep 21 17:49:50 EDT 1999 | John Thorup
| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.
Electronics Forum | Tue Sep 21 17:56:59 EDT 1999 | John Thorup
| | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | | Tha
Electronics Forum | Wed Sep 22 17:21:45 EDT 1999 | Hugh Martin
| | | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | |
Electronics Forum | Sat Oct 09 09:50:04 EDT 1999 | Ken Fong
Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are
Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F
Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to
Electronics Forum | Wed Sep 13 20:58:50 EDT 2000 | Dave F
If you don't know what you have, how the blank are we sposed to tell you? Try your local fab. CEM1 - Opaque tan CEM3 - Translucent FR2 - Opaque brown FR3 - Opaque cream FR4 - Translucent FR5 - Translucent FR6 - Opaque white G10 - Translucent G11 -
Electronics Forum | Tue Nov 16 09:44:18 EST 1999 | - bobar
Ken, The technology you are referring to is also known as return-to-web. This panelization method involves a hard tooled perimeter die and a press equipped with an air cushion. The PCB circuit is punched out and then inserted or "pushed" back into
