Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
Electronics Forum | Mon Nov 07 16:34:55 EST 2005 | CW
If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? If I use 2 mil copper on the outside layers of a PCB, am I limited to what pitch of parts I can use? Specifically, will using 0603
Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW
hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h
Electronics Forum | Mon May 26 03:27:00 EDT 2014 | julianf
Thanks for your reply Sarason. I'm aware now that my goals seem very ambitious and infeasible. Let me formulate my problem in an different way that might be more realistic. Is it possible to measure a DIFFERENCE in strain between top and middle la
Electronics Forum | Wed May 14 10:20:37 EDT 2014 | julianf
Hello all! For my mechanical engineering study I want to etch a strain gauge in the Wheatstone bridge configuration in a copper layer of an PCB. The goal is to measure the strain occurring in an PCB even during the press process! We can measure with
Electronics Forum | Mon Oct 04 20:06:31 EDT 2004 | davef
We know SIR coupons are not ROSE coupons, but coupon boards are: * IPC-B-24 (copper and HASL, FR-4 and polyimide) * IPC-B-36 (bare copper and HASL, FR-4 and polyimide) * IPC Phoenix board (bare copper, FR-4) * IPC-B-25A (FR-4, bare copper only)
Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan
Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Thu May 29 14:27:04 EDT 2003 | larryk
This flex is .001" Kapton polyimide. The flex portion of this rigid flex consists of 3 layers of 1 oz copper with 5 layers of Kapton. Part of the flex is sandwiched in standard FR4 with two layer of copper on each side for a finished thickness of .
Electronics Forum | Thu Jun 25 11:47:39 EDT 1998 | Steve A
| Hi there, | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | Appreciated for your help. | rgs, | chiakl Chiakl, It looks like you are speaking of what could
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