Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef
BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl
Electronics Forum | Thu Jan 03 07:49:20 EST 2002 | hany_khoga
Thanks Scott: The Assembley is Mixid ( reflow then wavesoldered). It is One curcuit. Is the Tg averagely known for FR4 PCB assemblies? Hany
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Sat Nov 03 05:41:07 EST 2001 | Ben
Hi Could somesomeone help to let me know can bare PCB (FR4) is damaged by thermal shock? Can difference of CTE from copper or solder to FR4 damage PCB from apply heat too fast? Any specification or standard can i refer? Thank you Ben
Electronics Forum | Wed Jul 18 10:16:08 EDT 2018 | ir11
Thank you for your response and information. I don't have any idea on what is Hybrid Circuits but if I will use ceramic PCB does my current SMT line need to change which running FR4 PCB material? My apologized for my queries. Thank you. IR11
Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare
I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe
Electronics Forum | Thu Oct 15 10:26:13 EDT 1998 | Dave Celestian
I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder mach
Electronics Forum | Wed May 05 05:41:02 EDT 2021 | jineshjpr
Hi All, Need your suggestions on the below queries: 1. What will happen if the Au thickness maintained @ 0.5 to 1 micron (Where Ni Thick is within 3 to 5 microns) in 0.2mm Thickness FR4 PCB. 2. Is there any solder quality affcted during Reflow Solder
Electronics Forum | Mon Dec 12 08:26:35 EST 2005 | eksoftware
Hi All, I'm looking for a second user desktop wave solder machine ie Bonkote or the like. If anyone has one for sale please mail me! I have to flow thru hole fr4 pcb's 100mm * 68mm, long side over wave. Any advice on suitable machines appreciated
Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd
What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.
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