Electronics Forum | Fri Oct 08 13:04:15 EDT 1999 | Dave F
| Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | PCB is FR4 | Solder Mask is LPI | Reflow and W/S Profile = Standard | | thanks and rega
Electronics Forum | Thu Apr 18 11:44:34 EDT 2002 | jsmith01
Does anyone know of a PCB material that is better at preventing arcing than fr4 or g10?
Electronics Forum | Thu Feb 21 04:41:37 EST 2008 | mun4o
hi,Toni, we use only FR4.Some of PCB we order in China and Taiwan.With these PCBs we can't any problem.Other PCB we order here in Bulgaria.The problems with voids start last year - we have voids only in PCBs from Bulgarian factory.The process is sam
Electronics Forum | Wed Jan 27 15:14:14 EST 2021 | stephendo
Ask your PCB suppliers what they do with their scrap FR4. Especially if any are local to you. I predict that you will not be happy with their answer.
Electronics Forum | Mon Nov 22 10:15:50 EST 1999 | Boca
Will, Wolfgang and Deon are exactly right on target. You just have to watch which side is built first. I began doing double sided reflow like this in the mid '80's, it works great. I used FR4/ GT material to hold the PCB up off of the conveyor,
Electronics Forum | Thu Sep 15 02:51:45 EDT 2005 | Joris Groot Koerkamp
In our current process we don't need to dry our pcb's. We use FR4 HASL boards. For the leadfree process we want to use NickelGold plated boards. Do we have to dry these boards for the leadfree process or can we just seal them with silica gel?
Electronics Forum | Wed Jan 27 21:43:44 EST 2021 | stephendo
Where I was before, someone started keeping the scraps because he wasn't sure where to put them. Then everyone did and it built up. We had a couple local PCB suppliers and asked what they did. Landfill. I think FR4 with masking isn't amenable to
Electronics Forum | Fri May 15 18:13:35 EDT 1998 | Earl Moon
| | | Does the temp. profiles used to reflow double sided pcb's through a IR oven | | on FR4 board material have to be re-established if it is changed to | | polyimide? Boards will be baked out prior to assembly. | | any response would be most appr
Electronics Forum | Sun Jul 29 23:58:08 EDT 2001 | Frank
Hi Dave Thanks for your information. The problem that I found is paste not stick well on pads ( solder paste printing process). When the table move down (PCB saperate from stencil) some of paste stick on aperture instead pads. Solder paste : Delta
Electronics Forum | Thu Feb 27 03:26:13 EST 2003 | damianlai
Hi, I would appreciate some advice / recomendations regarding conditioning of PCB's before use. Our standard PCB's are double sided and rigid multilayer FR4. We are currently baking everything over 3 months old for 2 hours at 125 degrees C. Is thi
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
