Electronics Forum | Thu Apr 25 01:20:58 EDT 2019 | smith88
I am having fractures in my tantalum caps, I believe it is from out fading but I am having a hard time convincing others. Where they are not hermatically sealed are thes fractures a concern? Moisture is entering the body regardless of the fractures?
Electronics Forum | Mon Dec 26 13:24:12 EST 2005 | mariss
I'm assuming the fracture in tension; the fracture doesn't show even at X50. The broken edges are that clean. I would expect spalling at the fracture edges if it were a compression or torsional fracture. This makes me belive the board expands and pul
Electronics Forum | Fri Aug 16 12:32:56 EDT 2019 | edhare
Steve, Yes, in my experience clients send in field failures (so latent failures) that exhibit internal shorts when a secondary fracture propagates from a knit line fracture. These eventually short due to electro-migration from plate-to-plate through
Electronics Forum | Thu Aug 15 15:51:24 EDT 2019 | slthomas
Thanks, Stephen. I'm actually leaning towards that (knit line fractures), since it's the only thing I've found that really supports the fractures being planar like they are.
Electronics Forum | Fri Jun 25 15:48:55 EDT 2004 | tcp
The potting definitely is a factor in fracturing the grainy joints, but does not seem to damage a "good" solder joint.
Electronics Forum | Fri Oct 13 03:29:46 EDT 2006 | AR
Hi Could you specify what you mean by fracturing component legs?
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Wed Nov 21 04:46:27 EST 2001 | emmanuel
Yes, i confirm you that the BGA i'm refering to are Motorola BGA. The fractures that appear after 500 thermal cycles (-45�C/+125�C) are located in the solder joint/pad connection. We have been asked if this fractures are due to BGA & PCB design or to
Electronics Forum | Thu Oct 12 09:22:12 EDT 2006 | charless
Hi We are experiencing different failure modes between leaded and lead free through hole assemblies. The boards are PTH. In the case of lead free boards we are seeing fracturing of the component legs much earlier than we do with leaded assemblies. N
