Electronics Forum | Fri Feb 11 09:10:39 EST 2005 | davef
Welcome to the forum. Yes, there is a wide range of equipment types that can be used to measure the function of components after the board is assembled. Look here for test: http://circuitsassembly.com/bguide/
Electronics Forum | Tue Jul 25 03:10:05 EDT 2006 | reypal
If your Test tech able to analyze and tell you which exact ball/location is the problem, you may send it for cross section analysis and see how the solder connection behaves. also pls check your ESD implementation.
Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean
Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve
Electronics Forum | Wed Sep 30 08:21:07 EDT 2009 | cunningham
Hi We have a board at the moment thats passing ICT and passing functional test but its failing test after conformal coating has anyone had any experinces of this? or any idea what may be causing this?
Electronics Forum | Thu Jan 30 04:35:18 EST 2014 | aflex
HLC offers a new dimension for testing capabilities. HLC comprises software for data acquisition, test control, archiving and report generation functions which make the process fast, efficient and trusted. The performance of HLC software is heavily
Electronics Forum | Tue Jun 30 15:03:18 EDT 2009 | Geo
Dave, We have both situations where the grounded electrical equipment on the mat has insulative pads or does not have insulative pads. The workstations we have this problem with are test stations where electrical equipment is used on the test bench
Electronics Forum | Mon Jun 01 22:56:39 EDT 2009 | davef
Reflow soldering de-ages the capacitors. Two things may be affecting your testing. * Capacitance measurements are often erratic during testing for about 10 hours after de-aging. * Test limits should be set so that the capacitance value is within the
Electronics Forum | Thu May 16 17:46:02 EDT 2019 | davef
Be sure to consider STI Electronics, Inc.[www.stiusa.com) 256-461-9191], a sponsor of SMTnet: https://smtnet.com/company/index.cfm?fuseaction=view_company&company_id=52020 Although dated, here is the IPC list of test labs: https://www.ipc.org/4
Electronics Forum | Tue Oct 11 03:50:24 EDT 2022 | ky
Hi Everyone, we have here in our EMS supplier some finish goods that pass all our functional test but fail our final burning test. The burning test is a 30 minutes test which simulate customer use cases, during this test the product is subject to tem
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
