Electronics Forum: functional test capacitors (Page 16 of 48)

PCB cosmetic reject after reflow

Electronics Forum | Mon Aug 08 21:43:23 EDT 2005 | plcc

Hi Davef, After reflow, the pcb board turns yellowish color. However, the board still pass thru' functional test.

Functional Test Faulure due to BGA ICs

Electronics Forum | Mon Jul 24 13:53:38 EDT 2006 | Chunks

Usually when someone is just guessing on what to t-shoot, they will always choose the most expensive part. BGA, QFP, GPS Module....... Same groups believe you can get rid of defects by wearing smocks.

Functional Test Failure due to BGA ICs

Electronics Forum | Tue Jul 25 08:34:30 EDT 2006 | GS

Does your board passes also through the wave solder step ? If, yes, it could be a matter of secondary reflow on BGA ball solder joints. Best Regards....GS

advice on selecting ATE/ICT

Electronics Forum | Sat Sep 22 23:57:53 EDT 2007 | accurex

The selection of Test equipment primarily should be driven by the requirement of fault spectrum you would like to capture. If you are looking at Manufacutring defects MDA/ICT would do the job, if you would like to cover the functional aspect a combin

Topaz blow part off when picking up.???

Electronics Forum | Tue Jul 28 09:29:48 EDT 2009 | christian01976

Hello! Did you test the blow off function manually with the input/output monitor? Mayba there is the wrong plug at the valve...

tarnishing gold surfaces

Electronics Forum | Wed Nov 10 16:33:09 EST 2010 | esoderberg

I don't. However we perform inline ICT and functional testing on both sides and the first side has never had issues. It is only when we flip the board and start reflowing on the bottom side.

Ultrasonic wash for BGA

Electronics Forum | Thu Oct 05 13:33:28 EDT 2017 | duchoang

We did some tests with good result. No failure physically and functionally. Is there report/study/documents about this procedure so we can convince customer to approve our process using ultrasonic wash. Thank you, Dave

Dropped board criteria

Electronics Forum | Mon Jul 01 04:35:22 EDT 2019 | sssamw

It depends on your product application requirement, normally should not drop off board for automotive. Even the dropped board pass function test in plant, it will have problem in its working environment.

Pogo Pins

Electronics Forum | Wed Sep 08 19:58:17 EDT 2021 | kylehunter

Yes, we soldered some Mil-Max pins on a functional test board before. Utter nightmare. We managed to finally get them on, but yes, terrible wetting, and they act as total thermal sinks. Make sure to oversize you pads.

Glass BGA

Electronics Forum | Tue Mar 28 14:23:11 EDT 2023 | smith88

Glass Micro BGA- I consistently have chips or micro cracks from the manufacture and some happen during install, what functionality risk do these pose to the product? They pass test... I cannot find an established criteria for this type of component


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