Electronics Forum | Thu Dec 01 21:30:31 EST 2005 | davef
Primary methods used to test assembled circuit boards are: * Automated test equipment [ATE] * Manual bench-top functional test equipment Assembled printed circuit board ATE market segments are: * In-circuit ATE * Functional ATE * Boundary Scan AT
Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah
Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE
Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj
We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at
Electronics Forum | Fri Jul 10 04:49:25 EDT 2009 | stepheniii
Make sure you understand there is a wide margin of measurement error when measureing some values of capacitors.
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
Electronics Forum | Thu Jul 09 00:15:39 EDT 2009 | jan_mancelita
Hi, do you know where and how we can tests 0402 ceramic capacitors? We would like to test them individually before we place them on our board; so as to get some test yield and the distribution of the parameters of this component based on the publish
Electronics Forum | Fri Jun 14 13:47:21 EDT 2013 | rway
Chances are this is not a component failure. First, these are passive components with passive testing on the ICT. He may have guarding issues, but more information is required as has been stated. Are all capacitors with the same P/N failing in dif
Electronics Forum | Tue Feb 05 14:35:30 EST 2013 | rway
In order to test a reed switch on the Teradyne, you will need an electro-magnet mounted inside the fixture. It will need to be mounted directly under the reed. First perform the passive testing (TVSV or Cont), then the active test. Drive the coil
Electronics Forum | Tue Nov 26 09:05:48 EST 2019 | scotceltic
Thank you for the response. Nothing in the datasheet referring to a percentage of thermal pad coverage. I am thinking along the same lines. We are not failing any thermal or functional testing as is so am thinking there is no problem here except m
Electronics Forum | Sat Mar 10 07:02:23 EST 2007 | imounen
i want to know what is the difference between ICT and functional test.is it mondatary to in ICT to test all components or there is a basic rules ,to know what are things to be tested . thanks ,
