Electronics Forum: furnace (Page 3 of 6)

PCB Warpage

Electronics Forum | Fri Apr 08 17:23:34 EDT 2005 | KEN

Warpage factors can cause: 1. Boards can not transfer down conveyor belts or wedge at transitions. 2. May not enter into machinery due to interferences (like board clamps) 3. May fall off conveyor chain in furnace. Especially true of thin (PCMCI

Prifiling Board life cycle

Electronics Forum | Mon Dec 24 19:12:06 EST 2007 | adamben10

I'm shadowing an old posting posted by Odor back in March 2002. Any Expert out there, if you have good answer to the below questions, please dive in...Thanks in advance. 1) Does anybody have done the profiling board life time experiment? 2) The prof

Re: Nitrogen Oxygen effect on solder ball apperance

Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon

| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow

Moisture under chip capacitors

Electronics Forum | Thu Sep 11 23:50:51 EDT 2003 | Dean

Epoxy is hydroscopic. A cavity will form when the cure furnace reaches the boiling point of water. The steam expansion creates the pocket. It can be large enough to be filled with molten solder from the wave machine and cause a hard short under th

Board Support During Pick & Place

Electronics Forum | Mon Mar 01 21:52:56 EST 2004 | Ken

Asking the Grid Lok to flatten out the board is like asking the SMT Reflow Furnace to detab the panel. It was not designed to make up for the deficiencies of your fab supplier or your unsuported 1st reflow pass on the the chain conveyor. However, i

25 mil QFP soldering issue

Electronics Forum | Mon Jul 19 19:39:06 EDT 2004 | KEN

I once had a forced convection oven (insert brand here)...and the top 220VAC heater (reflow zone) had shorted to the frame ground, blowing the branch line fuses. THe machine had no idea the heater was out because the lower heater was heating the upp

Open BGA joint

Electronics Forum | Fri Sep 17 23:19:07 EDT 2004 | KEN

What is the component ball co-planarity spec? I have encountered many ceramic and ASIC devices that specify 7 mil max. If your stencil is 4, 5, 6 mil you WILL eventually have an open joint. You must deposit solder greater than or equal to your cop

Light tower events

Electronics Forum | Fri Apr 08 05:22:47 EDT 2005 | Bored

The light events are: Red - Alarm - Indicates that an alarm exists.This also occurs when the emergency power stop button has been used to stop the belt and turn off heater power. Orange - Alert - Indicates that an alert condition exists. Green - R

Internal Oven Calibration

Electronics Forum | Sat Feb 11 18:33:36 EST 2006 | KEN

One factor everyone overlooks is that furnace and external T/C wires are (generally) not calibrated. Unless you are sending your wires to a lab for NIST characterization your T/C wires are NOT calibrated. They (new wires)operate within a specifie

BTU VIP 98 Problem

Electronics Forum | Tue Oct 02 10:01:15 EDT 2007 | chrisgriffin

I once had a similar problem on a VIP98. The problem was with the FCU (furnace control unit). There was a burned IC on the lower left of the card. I don't remember what kind of part it was, only that it was very common and I got a new one from Dig


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