Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi
Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu
Electronics Forum | Fri Dec 08 16:54:42 EST 2006 | flipit
My experience with SMT LED packages is that certain LED package styles tend to float. This floating is caused because the LED is often only terminated on the bottom side of the LED package. Sometimes the LEDs are terminated like a SMT resistor with
Electronics Forum | Wed Dec 13 08:28:37 EST 2000 | CAL
1)having the leader tape overlap and taped square is key. 2)making sure the Butt splice of the carrier tape is cut square and come together with no gaps 3) I would put a piece of yellow splice tape on the underside of the carrier tape to help hold th
Electronics Forum | Wed Feb 01 04:29:37 EST 2006 | rlackey
That would be the lightning effect, with increased humidity reducing resistance. 1500 VDC or 1500 VAC? What is the distance between the edges of the pads - i.e. not the pitch of the component, but the actual physical distance between conductors? A
Electronics Forum | Fri Nov 30 15:23:03 EST 2007 | jdumont
The hot melt is prob the only way to go for that size gap. If you could decrease that gap I would suggest using 3M Scotchweld DP100FR. Check it out. We use the duo pak cartridges and mix nozzles with the gun. Very simple use and works great in our ES
Electronics Forum | Tue Jun 03 01:03:04 EDT 2008 | daxman
Hi, I think what you are describing is a half-etch QFN, which causes the 3 mil gap. In our process, we don't require solder to bridge this gap as it's internally connected to the bottom lead. I'm not sure if this is the question you're asking, but
Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng
The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.
Electronics Forum | Thu Oct 20 23:19:09 EDT 2005 | Cmiller
You should not be worried about these points in the SMEMA standard. You need to make it work for your application. If you are running really small boards, keep the gap between conveyors and the lead-in as tight as you can. If you are using large pane
Electronics Forum | Wed Dec 10 14:37:47 EST 1997 | Frank Murch
There is a direct relationship between adhesive strength and surface area. If you graph this it will be linear. The amount of the adhesive should be about 2/3 the gap between the pads. Pad designs change all over so a true and tried rule does not ex
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