Electronics Forum | Mon Mar 31 07:58:50 EDT 2008 | vinitverma
Assuming the following: L=Process Length of the oven t=Desired profile time in mins(depends on the paste/glue used) l=PCB length l1=gap between consecutive PCBs Then the total no. of PCBs per hour is" (L*60/t)/(l+l1) Vinit
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Sun Dec 05 22:43:27 EST 1999 | dreamsniper
Charley, Though my reply is quite late, it might be a good info for you and i hope that this info could help or could provide you some views. Some companies practice at least 1 board gap, which means the length of the pcb you are currently loading,
Electronics Forum | Tue Apr 25 22:16:31 EDT 2006 | KEN
I agree with Russ. The problem is your thermal isolation is so small 1/16 inch. Also, most ovens measure temperaure in the plenum. You don't solder in the plenum. Therefore, you have a intermidiate "zone" temp. mixing between the top and bottom
Electronics Forum | Thu Dec 10 16:57:32 EST 2009 | vetteboy86
I'm just getting into temperature profiling our PCB's. We recently bought a new reflow oven. The company purchased a mole before I was hired. This is what I will be using. What is the preferred way to attach the thermocouples to the PCB locations of
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
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