Electronics Forum: gas and cutter (Page 1 of 2)

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 10:12:11 EST 2011 | callckq

All, I try to find explanation(Article)on how Nitrogen gas can make tombstone defect even worst. However, I can't find one in the net. Anyone that has this information or article, appreciate if you can share with me...Thanks in advance.

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 16:34:03 EST 2011 | davef

Google: nitrogen reflow tombstone https://www.google.com/search?q=nitrogen+reflow+tombstone&ie=utf-8&oe=utf-8&aq=t&rls=org.mozilla:en-US:official&client=firefox-a

Nitrogen gas and Tombstone defect

Electronics Forum | Thu Nov 24 07:41:33 EST 2011 | davef

Here's a paper from the SMTnet Newsletter http://www.smtnet.com/library/files/upload/dispelling_10_myths_about_nitrogen_reflow__andy_mackie.pdf

Nitrogen gas and Tombstone defect

Electronics Forum | Tue Nov 29 14:57:45 EST 2011 | jlawson

Sorry on N2 and tombstone, many other aspects cause tombstones and n2 in itself does not cause tombstones. It can help make other bad variables tip over edge to cause tombstones more than with no N2. Get these right then N2 is not issue.

Nitrogen gas and Tombstone defect

Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson

N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 10:51:12 EST 2011 | scottp

I've never seen a good article with a definitive explanation - just speculation that the increased wetting forces due to nitrogen result in increased tombstones. My own experience is that nitrogen is a very minor contributor to tombstones and can pr

Headers and SMT

Electronics Forum | Thu Oct 01 13:33:01 EDT 2015 | marlyn

Hey there fellow people with SMT > issues... What's the proper procedure for > soldering through-hole headers on the back-side > of the PCB (pins poking out on same side as SMT > parts)? ( Yes - I did the SMT side first and am > now faced with L

PDBE and PBB replacements???

Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef

RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet

Pick and Place Machine Validation

Electronics Forum | Thu Mar 10 16:49:13 EST 2005 | Mark

Precisely why I run like hell at the sight of a salesman. Though some are actually pretty knowledgeable engineers (these folks are not the cookie-cutter catalog pushing guys).

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 17:32:17 EDT 2006 | flipit

Hi, A little off subject but I just finished a quick little experiment where I placed 0201 to 1206 and some ceramic resonators at specific distances off the scored edge. The distances from scored edge ranged from 0.025" on up at 0.025" increments.

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