Electronics Forum: gas tube (Page 1 of 1)

What kind of fire extinguisher

Electronics Forum | Tue Mar 24 09:04:33 EDT 2009 | sachu_70

External CO2 extinguishers certainly help. But requires the alertness of a trained personnel to use the same effectively during a fire. I have also come across a solution wherein the extinguisher is kept always connected to continuously deliver pres

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Wed Dec 20 22:24:03 EST 2000 | Greenman

Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Wed Dec 20 22:25:26 EST 2000 | Greenman

Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Wed Dec 20 22:26:01 EST 2000 | Greenman

Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d

VOIDS on Solder joint (backside of D2PAK heatsink)

Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan

Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F

| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |

Lead-Free alloy determination in repair / rework

Electronics Forum | Tue Mar 08 11:50:55 EST 2011 | pgoodyear

As a technician that does frequent board level repair / rework some issues have come to mind. I have been an electronics technician for almost 50 years. In that time I have seen the evolution of electronics from point to point wiring using vacuum

Re: solder mask

Electronics Forum | Sun Aug 15 05:45:15 EDT 1999 | Brian

Boca, Dave Sorry, but I cannot let this go. I'll go along with you that, at the time that the Montreal Protocol was initially signed (September 1987), there was no scientific proof that CFCs etc. were causing ozone depletion. There was, however, ve

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean

| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60

Re: BGA repair/rework

Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon

| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting

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