Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
Electronics Forum | Fri Oct 10 16:23:59 EDT 2014 | dilogic
First, plug all holes with nozzles or plugs. Then use I/O diagnostics to fire changer up and activate vacuum. Then try to remove each of the nozzles and see if the vacuumm holds. If it does, check vacuum detector switch (mounted on changer side). The
Electronics Forum | Wed Apr 26 06:51:11 EDT 2023 | poly
I'm looking to make dedicated tooling for my mpm stencil printer. We only make 3 different boards and they are the same size panel so I'm planning to make one bit of tooling for them. One board is 0.6 mm and sometimes I have problems with it not bein
Electronics Forum | Thu May 25 21:50:27 EDT 2000 | Dave F
Bill: I'd expect better gasketing on a nice flat solder mask surface rather than the edge of the stencil opening mashed down on a irregular shaped hunk of solder attached to a pad. Stop thinking and get printing Dave F
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith
I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing
Electronics Forum | Wed Mar 15 21:39:56 EST 2006 | Chunks In Cebu
H Steve, I understand what you're asking except the "defingin fine pitch bricks" thing. Do you mean there is better gasketing, less dog-earing after snap-off or something else? Just curious. I've always used 45 degrees.
Electronics Forum | Tue Mar 20 14:34:45 EDT 2007 | realchunks
Hi Bill, Gasketing between the board and stencil may leak alittle, giving you a fuzzy print. If not, you should be OK. Another variable may be you need to perform an understencil wipe more often, adding to your cycle time. So why ya wanna double
Electronics Forum | Wed Mar 21 19:01:33 EDT 2007 | dekhead
If you MUST double print, probably to get good aperture fill near board edges, I would recommend letting off on pressure (maybe 20%) to minimize the bleed. Alot depends on your board (gasket) quality.
Electronics Forum | Sat Mar 29 12:05:09 EDT 2008 | davef
Install a gasket made of a non-esd safe material that can be die cut at a station equiped with an ionizer.
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