Electronics Forum | Tue May 09 22:57:58 EDT 2006 | davef
The NexLev connector is built in a stripline construction, providing a continuous ground plane for each signal contact. The connectors come as tenrow connectors with 100, 200, or 300 positions at possible stacking heights from 10 mm to 30 mm. Technic
Electronics Forum | Fri Feb 11 09:48:56 EST 2000 | Christopher Lampron
Dear Masdi, Solder beading (as opposed to solder balls) is usually caused by volume of solder paste, displacement of solder paste when component is placed and sometimes the proximity of the solder depositions for that component. Basically, a small a
Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F
Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther
Electronics Forum | Wed Aug 30 09:56:37 EDT 2000 | NLykus
Hi Ramon, We have had this problem before on our Seho Wave Solder Machine. We are currently using a spray fluxer as well. By imersing the PCB into the flux you stated you are getting good results. What you need to do is check your spray patter
Electronics Forum | Thu Aug 24 10:44:11 EDT 2000 | James
Ok, here's why we preheat. In my limited experience at our facility I have found that preheating the pallets a half hour before running boards thru the wave helps create a better gasket. We were having problems where the first boards run with the p
Electronics Forum | Wed May 17 10:19:25 EDT 2000 | C.K.
Hey Dave: At our facility, we use those masks that filter out particulates. Our safety department requires all wave operators, maintenance, and even wave process engr's (like me) to have these masks checked every 6 months for proper gasketing, filte
Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F
Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o
Electronics Forum | Fri Jan 14 17:24:08 EST 2000 | John Thorup
Yeah, it would be kind of expensive to replace all of your stencils but it's the only real answer. Be sure that all your new and replacement stencils have a home base or home plate shape for the passives. This reduces the paste volume near the cent
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Sun Sep 27 13:32:59 EDT 1998 | S. Evers
| | I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design. | The firm who can help is K&J marketing their new KEPOCH stencil material is a (plastic) pol
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